ANSYS Recruitment 2018 | R&D Engineering Intern

ANSYS Recruitment 2018:ANSYS has invited a notification for the Application of  R&D Engineering Intern for the freshers in the city of Bangalore. Interested candidates can apply online on or before the dates mentioned below.It is really a good opportunity for all those aspirants who want to work in a dynamic company called ANSYS. ANSYS brings clarity and insight to customers design challenges through fast, accurate and reliable engineering simulation.Using simulation, the worlds most innovative companies are able to design products that wouldn’t otherwise be possible to bring to market. Customers trust our software to help ensure product integrity and performance was the slogan of ANSYS.I also request to read this article on ANSYS Recruitment 2018  till end so that you can understand what the eligibility Criteria,Pay scale etc.was mentioned for that particular job.

Other Details of ANSYS Recruitment 2018:

Name of Organization    : ANSYS 

Company                          : ANSYS Software Pvt Ltd.

Position                            : R&D Engineering Intern

Experience                       : Freshers

Job Location                    : Bangalore

Salary                               : Best In Industry

Eligibility Criteria of ANSYS Recruitment 2018:

  • Ability to complete high-quality work on time
  • Basic understanding of electronic design at gate level and/or transistor level
  • Progress toward BE / B.Tech or ME / M.Tech degree in Computer Science, Electrical Engineering, or related field
  • Proficiency in Python, C or C++
  • Working knowledge of the Linux operating system
  • Strong basic knowledge of data structures, algorithms, and debugging
  • Ability to learn quickly, understand complex systems and to work closely with other.

Job Description of ANSYS Recruitment 2018:

  • This summer intern will join the RedHawk-SC Research and Development team.
  • He or she will develop features and algorithms for the distributed computing infrastructure, graphical user interface and other advanced design-data-import and analysis capabilities in distributed framework.
  • Innovation in semiconductor design and manufacturing enables smaller device architectures with higher performance and energy efficiency for powering the smart product revolution.
  • The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures, bring out design challenges related to power and reliability, affecting design closure.
  • ANSYS simulation and modeling tools offer the sign-off accuracy and performance needed to ensure power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.



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